In-depth Analysis of H5AN4G6NBJR-UHC Technical Parameters and Industry Applications

I. Core Technical Parameters and Characteristics

H5AN4G6NBJR-UHC is a DDR4 SDRAM memory chip launched by SK Hynix, specifically designed for high-performance computing and industrial applications. Below is a comprehensive analysis of its key parameters:

Basic Specifications

  • Capacity and Bit Width: 4Gb (256Mx16), supporting dual-channel architecture. A single chip can form a 4GB memory module.

  • Data Rate: The mainstream version is DDR4-2400 MT/s (equivalent frequency of 2400MHz). Some sources indicate that a DDR4-2666 MT/s version exists, which needs to be confirmed based on specific application scenarios.

  • Voltage: The standard operating voltage is 1.2V, supporting a ±5% fluctuation range (1.14V~1.26V) and complying with JEDEC specifications.

  • PackagingFBGA-96 Ball Grid Array (BGA) packaging, featuring a compact size (approximately 10mm x 10mm), suitable for high-density PCB layouts.

Physical and Environmental Adaptability

  • Temperature Range:

    • Standard Version: 0°C ~ 95°C (commercial grade).

    • Industrial-Grade Version (e.g., UHIR): -40°C ~ 95°C, suitable for extreme environments.

  • RoHS and Environmental Compliance: Lead-free and halogen-free, meeting EU environmental directives.

Timing and Performance

  • Typical Timing: CL17-17-17-39 (for DDR4-2400), supporting XMP (Extreme Memory Profile) automatic overclocking configuration.

  • Bandwidth: The theoretical peak bandwidth is 38.4GB/s (calculated as 2400MT/s x 16bit/8), which can meet the data throughput requirements of mid-to-high-end CPUs.

II. Industry Application Scenarios and Cases

Consumer Electronics Field

  • Solid-State Drive (SSD) Cache:

    Entry-level NVMe SSDs such as the Toshiba RC500 adopt H5AN4G6NBJR-UHC as an independent cache to improve random read/write performance. In actual tests, the 4K read speed can reach 1490MB/s and the write speed 1376MB/s, significantly optimizing system response.

  • Game Console and PC Memory:

    When paired with AMD Ryzen 5 or Intel i5 processors, a single 4GB module can form 8GB of dual-channel memory, enabling smooth operation of mid-graphics-quality games like League of Legends.

Industrial Control and Automation

  • PLC (Programmable Logic Controller):

    The industrial-grade version (e.g., UHIR) is selected for Siemens S7-1500 series PLCs, which operate stably in low-temperature environments of -40°C and support real-time data processing and equipment control.

  • Smart Meters and IoT Terminals:

    Huawei IoT gateways adopt H5AN4G6NBJR-UHC, combined with low-power design, to achieve 24/7 data collection and edge computing.

Automotive Electronics

  • In-Vehicle Infotainment (IVI) System:

    The central control screen module of Tesla Model 3 integrates this chip, supporting multi-task processing (navigation, media playback, vehicle settings) and ensuring a smooth, lag-free interface.

  • Autonomous Driving Domain Controller:

    NVIDIA Orin platforms use H5AN4G6NBJR-UHC to achieve high-bandwidth data caching, meeting the real-time processing needs of LiDAR point clouds and camera images.

III. Selection Recommendations and Procurement Guide

Version Differentiation Tips

  • Model Suffix Interpretation:

    • UHC: Standard industrial grade (0°C~95°C).

    • UHIR: Wide-temperature industrial grade (-40°C~95°C), with a price approximately 15% higher.

  • Chip Quality Screening:

    Read SPD (Serial Presence Detect) information using tools like CPU-Z or Thaiphoon Burner. Prioritize selecting CJR/DJR versions (Tier 2), which have better overclocking potential than JJR versions (Tier 3).

IV. Future Technological Evolution and Outlook

Process Upgrade

SK Hynix plans to mass-produce DDR4 chips with 1a-nanometer process in Q4 2025, which will reduce power consumption by 10% and cost by 15%. However, the 1y-nanometer production line where H5AN4G6NBJR-UHC is manufactured will be gradually phased out.

Interface and Protocol

  • Popularization of DDR4-3200: As Intel Raptor Lake Refresh processors support DDR4-3200, H5AN4G6NBJR-UHC may launch a high-frequency version (e.g., UHCR) in the future to meet the needs of new platforms.

Environmental Protection and Sustainability

Hynix has committed to using 100% renewable energy by 2030. The next-generation product of H5AN4G6NBJR-UHC will adopt cobalt-free packaging materials to further reduce its carbon footprint.
Summary: With its high reliability, wide-temperature adaptability, and cost-effectiveness, H5AN4G6NBJR-UHC will maintain its market position during the transition from DDR4 to DDR5. When selecting this chip, enterprises need to comprehensively consider application scenarios (consumer/industrial/automotive grades), budget constraints, and supply chain stability. At the same time, they should pay attention to the progress of domestic alternative products and manufacturers' production capacity dynamics to formulate an optimal procurement strategy.