Translation of Winbond W25Q16JVUUIQ Parameters

The W25Q16JVUUIQ from Winbond Electronics is a high-performance SPI NOR Flash memory device. As a 16Mbit model in the W25Q series, it is specifically designed for industrial-grade embedded systems, balancing high-density storage with high-speed data transmission. Below is an analysis of its core parameters based on official documents and industry standards (please refer to the latest datasheet for the most accurate information):

1. Basic Parameters

  • Storage Capacity: 16 Mbit (2 MB), organized as 2M × 8 bits. It supports flexible erasure operations (4 KB sector / 32 KB block / 64 KB block / full-chip erasure) to adapt to different data management scenarios.

  • Package TypeUSON-8 (4×3 mm) — an 8-pin ultra-miniature surface-mount package with a pin pitch of 0.5 mm. It is suitable for high-density PCB layouts and saves space.

  • Technology TypeSLC (Single-Level Cell). Each cell stores 1 bit of data, providing high reliability and durability (100,000 P/E cycles for erasure/write lifespan and 20 years of data retention).

2. Interface Characteristics

  • Interface Types:

    • Standard SPI (single-channel I/O)

    • Dual SPI (dual-channel command/address/data transmission)

    • Quad SPI: Four-channel parallel transmission, supporting XIP (Execute-in-Place). Programs can run directly from the Flash, improving system response speed.

  • Clock Frequency:

    • Standard SPI: Up to 133 MHz

    • Dual SPI: Equivalent to 266 MHz (133 MHz × 2)

    • Quad SPI: Equivalent to 532 MHz (133 MHz × 4), with a continuous data transmission rate of 66 MB/s.

  • Compatibility: Compatible with the JEDEC standard SPI command set, supporting multiple read modes (e.g., fast read, burst read) to reduce integration complexity with MCUs/SoCs.

3. Electrical Characteristics

  • Operating Voltage: 2.7 V to 3.6 V (wide voltage range, directly compatible with 3.3 V systems without additional level conversion).

  • Power Consumption:

    • Active Current: 5 mA (read), 10 mA (write), 15 mA (erase) (typical values).

    • Standby Current: <1 µA; <0.1 µA in deep sleep mode, making it suitable for low-power devices.

4. Reliability and Durability

  • Erase/Write Cycles: At least 100,000 P/E cycles per 4 KB sector, suitable for scenarios requiring frequent data updates (e.g., log recording, parameter configuration).

  • Data Retention: Over 20 years (at 85°C), meeting long-term storage requirements.

  • Environmental Tolerance: Operating temperature ranges from -40°C to +85°C (industrial-grade standard), adapting to harsh working conditions (e.g., industrial control, automotive electronics).

5. Security Features

  • Write Protection:

    • Hardware Protection: Locks the entire chip or specific blocks via the /WP pin to prevent accidental writes.

    • Software Protection: The configuration register (SR-1) supports block-level protection. Combinations of SEC (Sector/Block Protection), TB (Top/Bottom Protection), and CMP (Complement Protection) bits can be set for flexible area locking.

  • One-Time Programmable (OTP): 3 OTP pages of 256 bytes each, used for storing keys, encrypted information, or configuration parameters. Once written, data cannot be modified, enhancing data security.

  • Unique ID: A 64-bit unique identification code for device authentication, anti-counterfeiting traceability, or batch management.

6. Architecture and Functions

  • Continuous Read Mode: Supports single-command reading of the entire memory array, reducing address switching overhead and optimizing XIP performance (e.g., firmware execution, code caching).

  • Buffer Operation: A 256-byte internal buffer supports phased write/read operations, reducing the number of SPI interface interactions and improving efficiency.

  • Interrupt Mechanism: The /HOLD pin supports operation suspension, facilitating conflict management when multiple devices share the SPI bus.

7. Typical Applications

  • Industrial Control: Code storage and real-time data recording for PLC modules and industrial sensors.

  • Automotive Electronics: High-temperature environment storage for on-board ECUs and instrument clusters (AEC-Q100 certification status needs to be confirmed).

  • Communication Devices: Firmware and configuration parameter storage for routers and IoT gateways.

  • Consumer Electronics: Low-power data management for smart home devices and wearables.

8. Comparison with Same-Series Models

FeatureW25Q16JVUUIQW25Q16JVSSIQW25Q16FWUUIQ
PackageUSON-8 (4×3 mm)SOIC-8 (208 mil)USON-8 (3×4 mm)
Operating Voltage2.7~3.6 V2.7~3.6 V1.65~1.95 V
Interface Speed66 MB/s (Quad SPI)66 MB/s (Quad SPI)50 MB/s (Quad SPI)
Typical ApplicationIndustrial Devices with Compact SpaceIndustrial Devices with Standard PackagesLow-Voltage Portable Devices

9. Precautions

  • Timing Requirements: Ensure clock signal integrity in Quad SPI mode (rising edge overshoot < 20% VCC). It is recommended to verify signal quality using an oscilloscope.

  • Write Operation Process: The "Write Enable" command must be sent before each write/erase operation, and subsequent operations can only be executed after the Busy bit is cleared.

  • Bad Block Management: Bad blocks are pre-marked at the factory (max. 20 blocks). The system must scan and map these blocks during initialization to avoid data loss.

10. Supply and Support

  • Package & Packaging: USON-8 (4×3 mm), available in reel and cut tape packaging to support mass production.

  • Supply Status: Active (in mass production), supporting the Product Longevity Program for long-term supply.

  • Development Resources: Official datasheets, application notes, and reference driver code are available via the Winbond official website or authorized distributors.

Summary

With its compact packageindustrial-grade reliability, and high-speed Quad SPI interface, the W25Q16JVUUIQ is an ideal choice for small-to-medium capacity storage scenarios. Its USON-8 package is suitable for space-constrained devices, while hardware/software write protection and a unique ID enhance data security. When selecting this device, consider the application’s voltage, temperature, and space requirements, and refer to the official datasheet for detailed timing parameters.