Winbond W25Q256JWFIQ Parameter Description

1. Core Storage Features

• Capacity: 256 Mbit (32 MB), organized as 32 M × 8 bits. It supports flexible partition management (can be divided into multiple sectors/blocks) and is suitable for storing large-capacity firmware, configuration data, or logs.

• Erase Units:

  The minimum erase unit is a 4 KB sector. It supports sector erase (4 KB), block erase (32 KB/64 KB), and full-chip erase, making it suitable for small-file modifications (e.g., parameter updates) and batch data clearing (e.g., firmware upgrades).

• Page Size: 256 bytes. A single write operation must be performed page by page; cross-page writes require splitting via software logic (to avoid data overwriting errors).

2. Interface and Transmission Performance

• Interface Type: Compatible with SPI (Single/Dual/Quad SPI) and QPI (Quad Peripheral Interface). The quad-channel mode significantly improves transmission efficiency.

• Clock Frequency:

• Single-channel SPI: Up to 133 MHz;

• Quad-channel SPI/QPI: Equivalent to 532 MHz, with a continuous transmission rate of up to 66 MB/s, meeting the requirements for high-speed firmware loading (e.g., wearable device startup) or large-volume data reading/writing.

• Data Transmission: Supports Burst Read to reduce interaction latency between the host and flash memory, making it suitable for transmitting continuous data (e.g., sensor data streams).

3. Power Supply and Power Consumption

• Operating Voltage: 1.7V ~ 1.95V. Designed specifically for low-power systems, it is suitable for battery-powered devices (e.g., smartwatches, wireless sensor nodes).

• Current Consumption:

• Active read (typical): 4 mA;

• Standby mode: ≤ 1 μA;

• Deep sleep mode: ≤ 0.1 μA, with a wake-up time of only 3 μs, making it suitable for scenarios requiring long-term standby and rapid response.

4. Package and Pins

• Package Type: 16-SOIC (0.295 inches wide, 7.50 mm wide) with a pin pitch of 1.27 mm. It integrates a /RESET hardware reset pin, which can force chip reset via an external signal to improve system recovery reliability in case of abnormalities.

• Core Pin Functions:

• Basic pins: CS (Chip Select, active low), CLK (Clock), IO0~IO3 (Quad-channel data I/O), WP (Write Protect), HOLD (Pause);

• Special pin: /RESET (Hardware Reset). A low-level signal lasting ≥ 1 μs can force chip reset, terminating any operations (e.g., programming, erasing). It is suitable for rapid system recovery in industrial scenarios (e.g., restart after abnormal power failure);

• Pin Multiplexing: When quad-channel mode is enabled (QE bit = 1), the WP and HOLD pins are multiplexed as IO2 and IO3. The hardware write protection function must be implemented via software registers.

• Suffix Explanation: In "JWFIQ", "JWF" represents 1.8V voltage, high-speed SPI interface, and 16-pin package; "IQ" corresponds to the RoHS environmental standard (lead-free process).

5. Performance Indicators

• Access Time:

• Random read: 6 ns (fast access mode). It supports Execute In Place (XIP), allowing code to run directly without being loaded into RAM, saving system memory.

• Continuous read: Up to 66 MB/s via Quad SPI, meeting the requirements for high-speed startup (e.g., embedded system booting).

• Reliability:

• Endurance: Typically 100,000 erase cycles;

• Data retention: > 20 years (at 85°C), suitable for long-term storage of critical data (e.g., device configuration, calibration parameters).

6. Operating Environment

• Temperature Range:

• Operating temperature: -40°C ~ +85°C (industrial-grade standard), enabling stable operation in harsh environments (e.g., industrial control cabinets, in-vehicle devices);

• Storage temperature: -65°C ~ +150°C, withstanding extreme transportation or storage conditions.

7. Functional and Security Features

• Write Protection Mechanisms:

• Hardware protection: The WP pin can lock specific areas (e.g., critical configuration areas) in standard SPI mode;

• Software protection: Flexible partition locking (prohibiting erasure/writing of specific sectors/blocks) via status registers (BP0~BP3 bits);

• Complement protection (CMP bit): Can reverse the protection strategy (e.g., switching from "top protection" to "bottom protection").

• Status Feedback: The status register outputs device status in real time (e.g., Busy status, Write Enable Latch (WEL)), avoiding read/write conflicts with the host.

• Security Features:

• 64-bit Unique ID (UID): Used for device authentication (e.g., anti-cloning, traceability);

• 128-byte OTP (One-Time Programmable) Area: Programmable once and permanently locked as read-only (suitable for storing keys, calibration data);

• 3 × 256-byte Security Registers: Support hardware lock bits (via SEC bits) to prevent unauthorized access to sensitive data. Each register can be independently configured as read-only or one-time programmable (OTP).

• Software Reset: The chip can be soft-reset to its initial state via an instruction sequence (0x66 for reset enable + 0x99 for reset).

8. Application Scenarios

• Wearable Devices: Storage of system programs and user health data for smartwatches (low power consumption, small package);

• Smart Homes: Storage of configuration parameters and event logs for sensor nodes (long lifespan, industrial-grade temperature range);

• Industrial Control: Storage of firmware and real-time data caching for PLC controllers (high-speed transmission, reliability);

• Automotive Electronics: Storage of map files for in-vehicle entertainment systems (requires compliance with automotive-grade certification);

• IoT Terminals: Storage of edge computing code and sensor data caching (low voltage, large capacity).

9. Differences from Other Models in the Same Series

10. Design Considerations

• Hardware: It is recommended to connect 10kΩ pull-up resistors to the SPI interface to ensure signal stability; the /RESET pin requires an external pull-down resistor (e.g., 10kΩ) to avoid false triggering due to floating;

• Software: Before writing, the Write Enable instruction (0x06) must be executed, and the target area must be erased first (a characteristic of NOR flash: data can only be rewritten from 1 to 0);

• Packaging Process: 16-SOIC supports manual soldering or reflow soldering. It is recommended to use a stencil with a thickness of 0.12~0.15 mm to ensure reliable pin soldering.

Data Sheet and Support

Summary